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Category Archives: PCB/FPC/PTF
Nov07
The Benefits of Using “Mirrored Panelization” for PCBs
In the electronics assembly manufacturing industry, what we commonly refer to as a “Mirrored Panel Board” or “Flipped Panel Board” actually comes in two types. The first type is a different-side mirrored panel board, where one board’s top side and … Continue reading
Oct31
The Limitations of Using “Mirrored Panels” or “Flipped Panels” in SMT
We all know that when producing PCBs and PCBAs, multiple individual PCBs are usually combined into one larger panel, a process called panelization, to improve production efficiency. Typically, these individual boards are arranged in a neat and consistent manner with … Continue reading
Oct24
Causes and Prevention of PCB Warping and Bending After Reflow
A reader recently asked: “In surface mount assembly, PCBs often warp or bend after going through the reflow process, which can cause issues like open solder joints or tombstoning. How can we overcome this?” To be honest, the reasons behind … Continue reading
Sep26
The Role of Immersion Gold and Electroplated Gold in PCB Soldering
Workingbear previously wrote an article about how insufficient gold thickness in the ENIG surface treatment of a PCB led to the oxidation of Electroless Nickel, weakening solder joints and causing components detachment during plug and unplug. However, many sources explain … Continue reading
Sep19
Does the Gold Thickness in ENIG PCBs Affect Component Detachment?
Does the Gold Thickness in ENIG PCBs Affect Component Detachment? Do you know how the thickness of the gold layer in ENIG surface-finished PCBs impacts soldering quality? What role does the gold layer play in PCBA soldering? How could the … Continue reading
