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Category Archives: PCB/FPC/PTF
Mar27
Does PCB Solder Mask Misalignment Lead to BGA Soldering Defects?
Recently, our company started a new project, and the R&D team has been pushing PCB layout requirements to the extreme. As PCBs size get smaller, the solder mask (S/M) design must also shrink accordingly. However, our current PCB manufacturers struggle … Continue reading
Mar20
What is Tg (Glass Transition Temperature) and Its Role in PCBs?
Glass Transition Temperature (Tg) is one of the most important properties of all plastic and epoxy resin materials. In fact, the Tg value is also an indicator of the quality of the fiberglass fabric used in PCB manufacturing. However, compared … Continue reading
Mar13
What is CTE (Coefficient of Thermal Expansion)? What is α2-CTE? How Does CTE Affect PCB Quality?
CTE (Coefficient of Thermal Expansion) refers to how a material’s geometric properties change as its temperature rises or falls due to thermal expansion and contraction. In practical applications, CTE is divided into two main categories: Coefficient of Linear Thermal Expansion … Continue reading
Mar06
What is the Popcorn Effect in PCBs and Electronic Components?
The Popcorn Effect in PCB and electronic components refers to the delamination (board cracking) or formation of bubbles when exposed to high temperatures during soldering. This phenomenon is similar to how popcorn pops—it happens because of trapped moisture inside. When … Continue reading
Feb27
What Is Solder Mask (S/M)? What Is Its Purpose on a PCB? Why Is It Usually Green?
In discussions about printed circuit boards (PCBs), you’ll often hear the term Solder Mask (S/M). But what exactly is a solder mask, and what role does it play in a PCB? Some also refer to it as solder resist. What … Continue reading
