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Category Archives: PCB/FPC/PTF
Mar06
What is the Popcorn Effect in PCBs and Electronic Components?
The Popcorn Effect in PCB and electronic components refers to the delamination (board cracking) or formation of bubbles when exposed to high temperatures during soldering. This phenomenon is similar to how popcorn pops—it happens because of trapped moisture inside. When … Continue reading
Feb27
What Is Solder Mask (S/M)? What Is Its Purpose on a PCB? Why Is It Usually Green?
In discussions about printed circuit boards (PCBs), you’ll often hear the term Solder Mask (S/M). But what exactly is a solder mask, and what role does it play in a PCB? Some also refer to it as solder resist. What … Continue reading
Feb20
PCB Popcorn Effect: Why it Happens and How to Stop It
The main reasons for PCB delamination or “popcorning” are primarily (1) moisture absorption and (2) excessive α2/Z-axis CTE (Coefficient of Thermal Expansion). Among these, moisture absorption is responsible for about 70% of delamination issues. Other factors, such as uneven thermal … Continue reading
Jan24
Top ENIG PCB Issues: Black Pad and Phosphorus-Rich Layers Explained with Prevention Tips
With the rapid adoption of smartphones, the trend toward miniaturized electronic products, and the EU’s requirements for lead-free manufacturing, Electroless Nickel Immersion Gold (ENIG) surface treatment PCB has become a popular choice for many electronic products. This is largely due … Continue reading
Nov21
What Are PCB Cross-out Boards (X-out Boards)?
In the PCB industry, there is a specific term called “Cross-out boards” or “X-out boards” to indicate that a panel of PCBs contains defective boards. The term “Cross” refers to marking these defective boards with an “X” symbol.
