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Category Archives: PCB/FPC/PTF
Nov06
PCB Edge Removal and De-paneling: Precautions for Manual Breaking
There are many ways to de-panel or remove the edge rails of a PCB, but the simplest and cheapest method is manual V-cut breaking. However, this method can easily lead to uncontrolled quality issues. Before using manual breaking, it’s important … Continue reading
Oct29
Three Common PCB Panelization Connection Methods: V-cut, Tabs, and Stamp Holes
When producing large volumes of PCBs (Printed Circuit Boards), multiple individual boards are often combined into one large panel. This panelized form is then processed through automated SMT production lines to improve efficiency and reduce costly machine idle time. When … Continue reading
Sep30
How PCB S/M and Silkscreen Thickness Can Mess with Solder Paste Volume and Even Cause BGA Shorts!
Over the past few days, Workingbear came across an issue I hadn’t really considered before. Here’s the story: an EMS (electronics manufacturing service) factory reported that during SMT production, they were seeing solder shorts under BGA components. After digging into … Continue reading
May29
Uncovering the Culprit: How CAF Turned Out to Be the Hidden Cause Behind PCB Micro-Shorts — From Suspicion and Analysis to Solutions
Workingbear’s company was having a tough time with a strange issue: intermittent micro-short circuits inside the layers of the PCB. Since the shorts didn’t show up near any components, it was really hard to figure out what was wrong. Recently, … Continue reading
May22
What is CAF (Conductive Anodic Filament) in PCBs? and How to Prevent It
One of our company’s products once experienced an issue called an “internal micro-short” in the printed circuit board (PCB). After investigation, we discovered the root cause was something called CAF (Conductive Anodic Filament). But let’s be honest—if you translate that … Continue reading
