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Category Archives: PCB/FPC/PTF
Dec03
PCB Edge Removal and De-paneling Methods: A Complete Overview
When making printed circuit boards (PCBs), individual boards are first combined into a big panel board. After components mounting or soldering, they are separated into individual boards using de-paneling tools. This article summarizes the three most common PCB de-paneling methods … Continue reading
Nov13
PCB Edge Removal and De-paneling: Stamp Hole Design
In most PCB (Printed Circuit Board) designs, panels are usually connected using V-cuts or tabs/ribs, and then separated with a V-cut scoring machine or a router de-panel machine. However, besides these two common connection methods, there’s another approach called the … Continue reading
Nov06
PCB Edge Removal and De-paneling: Precautions for Manual Breaking
There are many ways to de-panel or remove the edge rails of a PCB, but the simplest and cheapest method is manual V-cut breaking. However, this method can easily lead to uncontrolled quality issues. Before using manual breaking, it’s important … Continue reading
Oct29
Three Common PCB Panelization Connection Methods: V-cut, Tabs, and Stamp Holes
When producing large volumes of PCBs (Printed Circuit Boards), multiple individual boards are often combined into one large panel. This panelized form is then processed through automated SMT production lines to improve efficiency and reduce costly machine idle time. When … Continue reading
Sep30
How PCB S/M and Silkscreen Thickness Can Mess with Solder Paste Volume and Even Cause BGA Shorts!
Over the past few days, Workingbear came across an issue I hadn’t really considered before. Here’s the story: an EMS (electronics manufacturing service) factory reported that during SMT production, they were seeing solder shorts under BGA components. After digging into … Continue reading
