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Category Archives: PCB/FPC/PTF
May08
The Deep Dive: BGA Pads: SMD vs. NSMD (Strength, Voids & Design Considerations)
Hey folks, welcome back to the blog! Today, we’re diving deep into something absolutely critical for the reliability of almost every electronic gadget out there: BGA solder joints. You know, those tiny connections that hold complex chips onto our printed … Continue reading
Apr10
What is PCB (Printed Circuit Board)? What Are Rigid, Flexible, and Rigid-Flex PCBs?
In the electronic devices we use daily—such as remote controls, smartphones, refrigerators, TVs, air conditioners, and computers—there is a crucial component called the Printed Circuit Board (PCB). The name comes from the way its electrical circuits are formed, similar to … Continue reading
Apr03
PCB Warping and Bowing: Causes, Prevention, and Best Design PracticesPCB warpage
A user asked: “During the SMT process, PCBs often warp or bow after going through reflow high temperature. In severe cases, this can lead to defects like insufficient solder joints or tombstoning. How can we prevent and solve this issue?” … Continue reading
Mar27
Does PCB Solder Mask Misalignment Lead to BGA Soldering Defects?
Recently, our company started a new project, and the R&D team has been pushing PCB layout requirements to the extreme. As PCBs size get smaller, the solder mask (S/M) design must also shrink accordingly. However, our current PCB manufacturers struggle … Continue reading
Mar20
What is Tg (Glass Transition Temperature) and Its Role in PCBs?
Glass Transition Temperature (Tg) is one of the most important properties of all plastic and epoxy resin materials. In fact, the Tg value is also an indicator of the quality of the fiberglass fabric used in PCB manufacturing. However, compared … Continue reading
