Category Archives: Manufacture


Jan04
What is Step-up & Step-down Stencil? Selective Solder Paste Volume Increasing Solution

post on January 4, 2016

The trend in the electronics industry is toward smaller and smaller SMD components, with sizes such as 0402, 0201, and even 01005 becoming common (Note 1). Additionally, the pitch between pins on ICs has decreased to a fine pitch of … Continue reading →

Manufacture, SMT, Soldering     WorkingBear    Views (16,182)     comment (0)
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Jun17
Selectively/partial increase solder paste volume solutions

post on June 17, 2015

Why is it necessary to partially increase the solder paste volume in SMT soldering? To meet the demands of smaller and thinner electronic component designs, stencils are made as thin as possible to precisely control the tiny solder paste printed … Continue reading →

Manufacture, SMT, Soldering     WorkingBear    Views (6,298)     comment (0)
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Jun10
PCB rework: Selective solder mask removal by laser

post on June 10, 2015

As an engineer in the electronics manufacturing industry, have you ever encountered the need to rework a printed circuit board (PCB) to remove the solder mask? If so, how did you approach this problem? Traditionally, the solder mask is manually … Continue reading →

Manufacture, Quality     WorkingBear    Views (10,417)     comment (0)

Jun03
TQRDCE Performance Expectations and Review

post on June 3, 2015

This is an example that implement TRQDCE form for vendor survey. TQRDCE Introduction: The company’s approach to establishing and maintaining long-term working relationships involves creating and monitoring mutual performance expectations and measurements. The use of performance metrics, constructive feedback, and … Continue reading →

Manufacture, Quality     WorkingBear    Views (21,888)     comment (0)

May27
Improve BGA Solderability By Partially Increasing Solder Paste Volume

post on May 27, 2015

Improving the solderability of BGA (Ball Grid Array) packages is always a big challenge for the SMT (Surface Mount Technology) process. Fine pitch BGAs (with a ball pitch less than 0.8mm) are particularly difficult to solder onto the PCB. Additionally, … Continue reading →

Design, Manufacture, Quality, Soldering     WorkingBear    Views (9,566)     comment (0)
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