Seach This Blog
Tag Cloud
AOI Baking BGA Burn/In(B/I) CAF Carrier Component drop/detachment Concept Contamination Cpk DFx ECM (Electrochemical migration) ENIG FATP Fishbone Flux FVT Gold HASL HIP(Head-In-Pillow) ICT IMC LTS Manufacturing glossary MFI newbie NWO(Non-Wet-Open) OSP Panel & De-panel PIH Problem analysis & solving Reliability Short circuit small-talk Solder broken crack Soldering Solder paste Stencil Temperature Profile Troubleshooting V-cut Video/Youtube Warpage Wave-soldering X-raySponsor
Categories
- Case study
- Connector
- Corrugated Paper
- Design
- EDX/EDS/SEM/IMC/FTIR
- Fundamental Science
- Glue/adhesive/epoxy/underfill,
- Keypad
- Management
- Manufacture
- Moisture Sensitive
- PCB/FPC/PTF
- Personal Opinion
- Plastic
- Process
- Product Introduction
- Quality
- Reliability
- Role & Responsibility
- SMT
- Soldering
- SPC
- Test/Inspection
Bookmarks
Histats
Statcounter
Email Subscription
Author Archives: WorkingBear
May29
Uncovering the Culprit: How CAF Turned Out to Be the Hidden Cause Behind PCB Micro-Shorts — From Suspicion and Analysis to Solutions
Workingbear’s company was having a tough time with a strange issue: intermittent micro-short circuits inside the layers of the PCB. Since the shorts didn’t show up near any components, it was really hard to figure out what was wrong. Recently, … Continue reading
May22
What is CAF (Conductive Anodic Filament) in PCBs? and How to Prevent It
One of our company’s products once experienced an issue called an “internal micro-short” in the printed circuit board (PCB). After investigation, we discovered the root cause was something called CAF (Conductive Anodic Filament). But let’s be honest—if you translate that … Continue reading
May15
The Role of Process Engineers and Product Engineers in a Company
Many people, especially newcomers to the workforce, may feel confused when they first hear the term Process Engineer. What exactly does a process engineer do? First, let’s understand what process means. Simply put, a process refers to the manufacturing procedure—the … Continue reading
May08
The Deep Dive: BGA Pads: SMD vs. NSMD (Strength, Voids & Design Considerations)
Hey folks, welcome back to the blog! Today, we’re diving deep into something absolutely critical for the reliability of almost every electronic gadget out there: BGA solder joints. You know, those tiny connections that hold complex chips onto our printed … Continue reading
Apr30
Understanding the EDX Report: Can EDX Be Used to Estimate a Sample’s Chemical Formula?
Workingbear has noticed that many people still have questions about EDX/EDS elemental analysis reports. This is the second article where he tries to provide answers based on his knowledge. EDX (Energy-Dispersive X-ray Spectroscopy), also known as EDS, is actually an … Continue reading