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Author Archives: WorkingBear
Apr03
PCB Warping and Bowing: Causes, Prevention, and Best Design PracticesPCB warpage
A user asked: “During the SMT process, PCBs often warp or bow after going through reflow high temperature. In severe cases, this can lead to defects like insufficient solder joints or tombstoning. How can we prevent and solve this issue?” … Continue reading
Mar27
Does PCB Solder Mask Misalignment Lead to BGA Soldering Defects?
Recently, our company started a new project, and the R&D team has been pushing PCB layout requirements to the extreme. As PCBs size get smaller, the solder mask (S/M) design must also shrink accordingly. However, our current PCB manufacturers struggle … Continue reading
Mar21
Electronic Product Burn-In and Run-In: What They Are and Their Pros & Cons
In the early days, when electronic component design and manufacturing were still in their infancy, burn-in (B/I) was widely used to screen out defective products. This process helped eliminate early failures before products reached customers, reducing the risk of complaints. … Continue reading
Mar20
What is Tg (Glass Transition Temperature) and Its Role in PCBs?
Glass Transition Temperature (Tg) is one of the most important properties of all plastic and epoxy resin materials. In fact, the Tg value is also an indicator of the quality of the fiberglass fabric used in PCB manufacturing. However, compared … Continue reading
Mar13
What is CTE (Coefficient of Thermal Expansion)? What is α2-CTE? How Does CTE Affect PCB Quality?
CTE (Coefficient of Thermal Expansion) refers to how a material’s geometric properties change as its temperature rises or falls due to thermal expansion and contraction. In practical applications, CTE is divided into two main categories: Coefficient of Linear Thermal Expansion … Continue reading
