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Author Archives: WorkingBear
Jun29
Why Don’t devices Fall Off on First Side during SMT Second Reflow? Does the solder MP increase during the second reflow?
Why don’t the electronic components on the first side of the double-sided PCB fall off due to re-melting of the solder during the second time reflow process in the SMT oven? How much does the melting temperature of the lead-free … Continue reading
Jun20
Preventing BGA Solder Joint Cracking: Strengthening Design from the Source
BGA solder joint cracking has always been a nightmare for electronic assembly (industry) manufacturer, and there are many reasons that are beyond the control of assembly manufacturer, but the final result is often required to be borne by assembly manufacturer. … Continue reading
Jun13
How to Determine Whether Underfill is Needed for BGA?
A question from a netizen, “In the past, many mobile phone PCB assemblies would use Underfill depositing under the BGA package to enhance the mechanical strength of the solder joints. However, it has been found that most mobile phone assemblies … Continue reading
Jun06
Questions from Newcomer: Why is Solder Paste Needed for SMT Reflow since BGA Already has Solder Balls? Is Solder Paste Needed for BGA Repair?
Questions from a newcomer about electronic manufacturing assembly process: Since there are already solder balls locate on the BGA substrate, why is it necessary to apply solder paste on the PCB pads during SMT reflow? Is it necessary to apply … Continue reading
Jun01
What is Wave Soldering? Laminar Wave and Turbulent Wave Purpose
Before the development of Surface Mount Technology (SMT), almost all printed circuit board assemblies (PCBAs) had to go through the process of wave soldering to achieve the purpose of soldering electronic components to the board. The process of “wave soldering” … Continue reading
