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Author Archives: WorkingBear
Jul13
What is blind hole, buried hole and plating hole for PCB?
In the early response to a user’s question, WorkingBear mistakenly mixed up the terms “blind hole” and “buried hole” when talking about PCBs. To prevent similar errors in the future, WorkingBear took the initiative to study some books about PCBs … Continue reading
Jul11
Preventing Solder Cracks in BGA Designs: Strengthening Tips from the Design End
Lately, many colleagues have been asking WorkingBear for advice on designing BGA (Ball Grid Array) packages to prevent solder joint cracking and improve overall durability. This sudden interest came after a senior manager raised concerns during a new product development … Continue reading
Jul04
Exploring EVT/DVT/PVT: Explaining the Three Crucial Validation Stages in New Product Development
When developing a new product, it is common to conduct a “trial run” to obtain a prototype sample. This serves two purposes: firstly, it allows developers to further test and validate the prototype’s functionality, and secondly, it helps the manufacturing … Continue reading
Jun29
Why Don’t devices Fall Off on First Side during SMT Second Reflow? Does the solder MP increase during the second reflow?
Why don’t the electronic components on the first side of the double-sided PCB fall off due to re-melting of the solder during the second time reflow process in the SMT oven? How much does the melting temperature of the lead-free … Continue reading
Jun20
Preventing BGA Solder Joint Cracking: Strengthening Design from the Source
BGA solder joint cracking has always been a nightmare for electronic assembly (industry) manufacturer, and there are many reasons that are beyond the control of assembly manufacturer, but the final result is often required to be borne by assembly manufacturer. … Continue reading
