Seach This Blog
Tag Cloud
AOI Baking BGA Burn/In(B/I) Carrier Component drop/detachment Concept DFx EDX/EDS/SEM ENIG FATP Flux FVT Gold HASL HIP(Head-In-Pillow) HotBar ICT IMC LCM LTS Manufacturing glossary metal dome MFI newbie NWO(Non-Wet-Open) OSP Oxidation Panel & De-panel PIH Popcorn-Effect Problem analysis & solving PTF Red Dye Penetration Reliability Solder broken crack Soldering Solder paste Stencil Temperature Profile Troubleshooting V-cut Warpage Wave-soldering X-raySponsor
Categories
Bookmarks
Histats
Statcounter
Email Subscription
Author Archives: WorkingBear
Dec05
How Preventing Heavy Components from Falling during Secondary time SMT Reflow
With the rapid advancement of mobile communication technology, EMS (Electronic Manufacturing Services) providers worldwide are facing severe labor shortages. Furthermore, the Industry 4.0 trend has heightened the demand for automation in EMS facilities. As a result, many components that were … Continue reading
Nov28
When does SMT require Reflow Carriers and Full Process Carriers?
What is an SMT Reflow Carrier? Why is it sometimes necessary in SMT production? And when do we need an SMT Full Process Carrier? Are there situations where neither is required? The so-called “SMT reflow carriers or reflow templates” are … Continue reading
Nov21
Q&A for Beginners: Understanding SMT Stencils, Component Placement Sequence, DFM, and DFX
This is a query from a user regarding SMT (Surface Mount Technology) processes, focusing on topics such as stencils, determining component placement sequence, and explanations of DFM (Design for Manufacturability) and DFX (Design for Excellence). We believe these questions and … Continue reading
Nov16
What is SMT Red Glue (Dispensing) process? What are the limitations while use red glue process?
The “SMT dispensing” process, also known as the “SMT Red Glue” process in Asia, is a process where a glue is used to stick Surface Mount Device (SMD) parts to a Printed Circuit Board (PCB). The term “SMT Red Glue” … Continue reading
Nov02
How to Implement Paste-In-Hole (PIH) Process for Through-Hole Devices and Solve Solder Filled Percentage for PTH
The PIH (Paste-In-Hole) process involves directly printing solder paste onto the Plating Through Holes (PTHs) of a PCB (Printed Circuit Board). Subsequently, Through-Hole Devices (THDs) are inserted directly into these holes with pre-applied solder paste. At this point, some of … Continue reading
