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Author Archives: WorkingBear
Jan09
What is HIP/HoP? Uncovering the Causes of Head-in-Pillow Defects in SMT Reflow
The HIP (Head-in-Pillow) defect looks like a person resting their head on a pillow, not buried inside it. Recently, some people refer to it as HoP (Head-on-Pillow). Both terms refer to the non-wetting defect in the solder joints of BGA … Continue reading
Jan02
SMT Reflow Soldering Temperature Profiles Explanation and Precautions
The thriving development of the electronics industry owes much to the invention and improvement of Surface Mount Technology (SMT). Among the various SMT techniques, Reflow Soldering plays a pivotal role. In this discussion, we aim to shed light on some … Continue reading
Dec28
"Being Ready for Potential Layoffs" is the Best Strategy to Avoid Job Cuts
The Workingbear is used to seeing job cuts happen in global companies, especially those from the United States, whether they’re big or small. Normal downsizing is like the body’s “metabolism” – not necessarily a bad thing. Companies hire when there’s … Continue reading
Dec26
Another Option for Increasing Solder Volume in SMT – Solder Preforms
“Solder preforms” are pre-shaped small solder pieces that can be used to locally increase solder paste volume. They help improve solder quality and strength, addressing the limitations on solder paste caused by using a stencil, and are especially useful as … Continue reading
Dec19
Understanding the Impact of Solder Paste and Flux Composition on Electronic Board Assembly Quality
Solder paste is a crucial material in the domain of modern electronic assembly technology. It is used for soldering electronic components onto printed circuit boards (PCBs), this enabling the creation of ever-evolving technological products. The invention of solder paste played … Continue reading
