Author Archives: WorkingBear


Feb15
NWO (Non-Wet-Open) Defect in BGA Soldering: Causes and Possible Solutions

Recently, many have inquired about how to deal with Non-Wet-Open (NWO) issues when encountering BGA packaged ICs soldering. The defects associated with NWO are quite similar to those of HIP (Head-in-Pillow) and typically occur at the edges and corners of … Continue reading

Feb06
Purpose of Using Lead-Free Low-Temperature Solder (LTS) SnBi, SnBiAg in Soldering

The alloy composition of lead-free LTS (Low Temperature Solder) usually includes the metal “bismuth (Bi)” in addition to tin (Sn) to lower its eutectic point. The commonly used lead-free solder SAC305 has a melting point of 217°C, while Sn64Bi35Ag1 has … Continue reading

Jan30
Problem Analysis and Solving: 8D report

The “8D report” is a tool commonly used in the electronics assembly industry for “problem analysis and solving.” Due to its systematic and clear steps, the “8D report” is often utilized in responding to customer complaint cases. The term “8D” … Continue reading

Jan23
Why a BOM (Bill of Materials) is Critical in Electronic Product Development

A Bill of Materials (BOM) is a list of materials required for the production of an electronic product. It serves as an important bridge between the designer, manufacturer, and supplier. The BOM includes all the components, devices, and materials used … Continue reading

Jan16
RSS or RTS? Which SMT Profile Should You Choose?

Choosing between RSS (Ramp-Soak-Spike) and RTS (Ramp-To-Spike) for the reflow temperature profile in the SMT (Surface Mount Technology) process has been a constant dilemma for many engineers. Some face pressure from higher-ups to opt for RTS due to cost-saving benefits, … Continue reading