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Author Archives: WorkingBear
Mar05
What are ICT(In-Circuit Test) and MDA(Manufacturing Defects Analyzer) in Electronics Manufacturing? Any Benefits?
Do you know what ICT (In-Circuit Test) is? Please note that we are not talking about Information and Communication Technology (ICT) here. And what about MDA (Manufacturing Defects Analyzer)? If these tests are commonly implemented in PCB assembly manufacturing, what … Continue reading
Feb27
What is Graping Solder Defect in SMT Assembly? How to Fix it?
In the reflow soldering process of Surface Mount Technology (SMT) in electronic assembly, the occurrence of “Graping” solder defect refers to the situation where the solder paste does not completely melt and joint together during reflow. Instead, individual solder powders … Continue reading
Feb20
What is IMC (Intermetallic Compound)? How does IMC relate to PCB solder joint strength? Are there IPC standards for IMC thickness?
In the assembly and soldering process of printed circuit boards (PCBs), we often hear engineers or lab reports mentioning the term “IMC.” But what exactly is IMC? What role does IMC play in the PCB assembly (PCBA) soldering process? Does … Continue reading
Feb15
NWO (Non-Wet-Open) Defect in BGA Soldering: Causes and Possible Solutions
Recently, many have inquired about how to deal with Non-Wet-Open (NWO) issues when encountering BGA packaged ICs soldering. The defects associated with NWO are quite similar to those of HIP (Head-in-Pillow) and typically occur at the edges and corners of … Continue reading
