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Author Archives: WorkingBear
Aug15
Causes of Poor Solderability on HASL Finished PCBs (Data Collection and Analysis)
Workingbear personally doesn’t recommend using HASL (Hot Air Solder Leveling) surface-finished PCBs in today’s SMT reflow processes, especially for double-sided reflow or fine-pitch components located on 2nd side. The defect rate of soldering with HASL is quite high and hard … Continue reading
Aug08
What Do PCB and PCBA Stand For? What’s the Difference?
What is the difference between PCB and PCBA? This should be an easy concept to understand, but since someone asked Workingbear, let’s explain it a bit. If you find any errors while passing by, please let us know to correct … Continue reading
Aug01
3D CT X-Ray Non-Destructive 3D Tomography Analysis for PCBA and BGA Failures
In recent years, the commercial application of 3D CT X-Ray has become increasingly noteworthy. As the technology matures, more companies are investing in its development, making the equipment more affordable, though still not quite at a consumer-friendly price point. Additionally, … Continue reading
Jul25
Effects of Nitrogen (N2) in SMT Reflow on Various Soldering Defects
“Oxidation” is a major enemy of solder quality, but oxidation is a natural law of elements striving for stability that cannot be avoided. Using nitrogen (N2) to isolate solder from oxygen (O2) is one of the few effective methods currently … Continue reading
Jul18
Why Do Electronic Products Need Burn-In? What Are Its Pros and Cons? What Is Run-In?
In the early days, when electronic component design and manufacturing were still developing, the “burn-in” solution was used to screen out defective electronic components and products. This process allowed early-failing products to be identified and eliminated, preventing defective items from … Continue reading
