Seach This Blog
Tag Cloud
AOI Baking BGA Burn/In(B/I) CAF Carrier Component drop/detachment Concept DFx ECM (Electrochemical migration) EDX/EDS/SEM ENIG FATP Flux FVT Gold HASL HIP(Head-In-Pillow) ICT IMC Manufacturing glossary metal dome MFI newbie NWO(Non-Wet-Open) OSP Oxidation Panel & De-panel PIH Popcorn-Effect Problem analysis & solving PTF Red Dye Penetration Reliability Short circuit Solder broken crack Soldering Solder paste Stencil Temperature Profile Troubleshooting V-cut Warpage Wave-soldering X-raySponsor
Categories
- Case study
- Connector
- Corrugated Paper
- Design
- EDX/EDS/SEM/IMC/FTIR,
- Fundamental Science
- Glue/adhesive/epoxy/underfill,
- Keypad
- Management
- Manufacture
- Moisture Sensitive
- PCB/FPC/PTF
- Personal Opinion
- Plastic
- Process
- Product Introduction
- Quality
- Reliability
- Role & Responsibility
- SMT
- Soldering
- Test/Inspection
- Uncategorized
Bookmarks
Histats
Statcounter
Email Subscription
Author Archives: WorkingBear
Jun27
What is Function Verification Test (FVT) for Assembled Circuit Boards?
Function verification tests (FVT), or call Function Circuit Tests (FCT), are crucial for detecting defects in PCBA (Printed Circuit Board Assembly). These tests simulate the full functionality of the circuit board as if it were part of the final product. … Continue reading
Jun20
The Benefits of Using SMT Synthetic Stone or Aluminum Alloy for Reflow Carriers
With the advancement of technology, electronic products are becoming thinner and more compact. Consequently, electronic components are also getting smaller, and even the thickness of printed circuit boards (PCBs) is decreasing. The thinnest PCB Workingbear has seen is 0.4mm. Such … Continue reading
May30
Conformal Coating: How to Understand and Choose the Right Material
Conformal coating is a protective chemical coating or polymer film applied to printed circuit boards (PCBs) and critical electronic components to protect them from environmental factors such as moisture, dust, chemicals, and temperature extremes. This coating, typically 25 to 300 … Continue reading
May23
How to Resolve HIP or HoP Soldering Issues in BGA Solder Balls
BGA packages are prone to HIP, also known as HoP defects, during the reflow process, and it is an undeniable fact that the larger the size and the more balls a BGA package has, the more likely HIP is to … Continue reading
May02
Concept Clarification: IMC Layer Fracture Despite the Formation of Effective Solder Joints
In this blog, Workingbear has explored the causes and analysis of soldering cracks and electronic component detachment in several articles. It has consistently mentioned that most of the fractures occurring when electronic components detach happen at the Intermetallic Compound (IMC) … Continue reading