Seach This Blog
Tag Cloud
AOI Baking BGA Burn/In(B/I) CAF Carrier Component drop/detachment Concept Contamination DFx ECM (Electrochemical migration) ENIG FATP Fishbone Flux FVT Gold HASL HIP(Head-In-Pillow) ICT IMC Manufacturing glossary MFI newbie NWO(Non-Wet-Open) OSP Oxidation Panel & De-panel PIH Popcorn-Effect Problem analysis & solving PTF Reliability Short circuit Solder broken crack Soldering Solder paste Stencil Temperature Profile Troubleshooting V-cut Video/Youtube Warpage Wave-soldering X-raySponsor
Categories
- Case study
- Connector
- Corrugated Paper
- Design
- EDX/EDS/SEM/IMC/FTIR
- Fundamental Science
- Glue/adhesive/epoxy/underfill,
- Keypad
- Management
- Manufacture
- Moisture Sensitive
- PCB/FPC/PTF
- Personal Opinion
- Plastic
- Process
- Product Introduction
- Quality
- Reliability
- Role & Responsibility
- SMT
- Soldering
- SPC
- Test/Inspection
- Uncategorized
Bookmarks
Histats
Statcounter
Email Subscription
Popular Articles
- [39,568] What is IMC (Intermetallic Compound) in the e...
- [32,880] PCB Assembly
- [23,200] Copper Defined vs. Solder Mask Defined pad de...
- [21,648] TQRDCE Performance Expectations and Review
- [19,719] Why Do Screw Bosses Crack After Mold-In Screw...
- [16,246] SMT Reflow Soldering Temperature Profiles Exp...
- [15,888] What is Step-up & Step-down Stencil? Selectiv...
- [15,869] Why BGA soldering ball always crack(3)? IMC l...
- [14,153] Why do thinner PCBs will need carrier for ref...
- [13,073] Case study for the mold-in insert screw boss ...
-
Recent Posts
- Introduction to Process Capability — Three Common Indicators: Cp, Ck, and Cpk
- Youtube: QC 7 Tools – Fishbone (Cause & Effect Analysis) Diagram Introduction
- Customer Complaint About Oil Contamination on PCB: Who’s the Real Culprit? (FTIR Analysis)
- [Case Study] Troubleshooting a Customer Complaint – Keypad Malfunction Caused by Oil & Powder Contamination on the PCB
- What is Environmental Stress Screening (ESS)?
Recent Comments
- enrico on Customer Complaint About Oil Contamination on PCB: Who’s the Real Culprit? (FTIR Analysis)
- Enrico on The Deep Dive: BGA Pads: SMD vs. NSMD (Strength, Voids & Design Considerations)
- WorkingBear on Why BGA soldering ball always crack(13)? Usage Environment is the Biggest Challenge of Stress Sources
- boris on Why BGA soldering ball always crack(13)? Usage Environment is the Biggest Challenge of Stress Sources
- Jason Wong on What purpose of alloy metal of Cu, Ag, Zn, Sb, Bi added to solder paste?
- WorkingBear on What is IMC (Intermetallic Compound) in the electronic manufacturing industry?
- WorkingBear on What is IMC (Intermetallic Compound) in the electronic manufacturing industry?
- Hugo Cardenas on What is IMC (Intermetallic Compound) in the electronic manufacturing industry?
- Johnson on Why BGA soldering ball always crack(13)? Usage Environment is the Biggest Challenge of Stress Sources
- WorkingBear on Why BGA soldering ball always crack(2)? The composition of PCBA bonding-force
Sponsor
Outbound link test