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Category Archives: Test/Inspection
Jul24
Understanding ORT: What It Is and How It Differs from REL (Reliability)
ORT stands for Ongoing Reliability Test, and sometimes it’s written as Ongoing Reliability Testing. ORT is a very important quality control measure in electronics manufacturing. Its purpose is to continuously monitor the reliability of products during mass production, so that … Continue reading
Jun26
What is Environmental Stress Screening (ESS)?
Environmental Stress Screening (ESS) is a method used to apply certain environmental and operational stresses—such as power on/off cycles, bias voltage, pressure, thermal cycling, and vibration—to new or repaired products (usually electronics or components). The idea is to expose hidden … Continue reading
Mar21
Electronic Product Burn-In and Run-In: What They Are and Their Pros & Cons
In the early days, when electronic component design and manufacturing were still in their infancy, burn-in (B/I) was widely used to screen out defective products. This process helped eliminate early failures before products reached customers, reducing the risk of complaints. … Continue reading
Jan16
Inspection Methods for BGA Solder Ball Wettability and Soldering Defects
This is a summary post aimed at providing some guidance to newcomers in the electronics assembly field on methods for analyzing the solderability of BGA (Ball Grid Array) solder balls. Workingbear decided to write this after seeing someone ask about … Continue reading
Sep05
Using 2D X-Ray to Diagnose BGA Solder Void Issues
This is an X-ray inspection image of an MCU’s BGA soldering that failed after reflow. The owner mentioned that the BGA package was not functioning, but when pressing on the MCU, it would temporarily work again. Since Workingbear didn’t have … Continue reading
