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Category Archives: SMT
Jul27
The Myth of PCB Baking: Can Pre-Baking PCBs Improve Solderability?
WorkingBear has noticed that many engineers or managers involved in Surface Mount Technology (SMT) have a strong passion for “PCB baking,” but their understanding of the concept might not be very clear. If you browse through discussions on PCB and … Continue reading
Jul11
Preventing Solder Cracks in BGA Designs: Strengthening Tips from the Design End
Lately, many colleagues have been asking WorkingBear for advice on designing BGA (Ball Grid Array) packages to prevent solder joint cracking and improve overall durability. This sudden interest came after a senior manager raised concerns during a new product development … Continue reading
Jun29
Why Don’t devices Fall Off on First Side during SMT Second Reflow? Does the solder MP increase during the second reflow?
Why don’t the electronic components on the first side of the double-sided PCB fall off due to re-melting of the solder during the second time reflow process in the SMT oven? How much does the melting temperature of the lead-free … Continue reading
Jun20
Preventing BGA Solder Joint Cracking: Strengthening Design from the Source
BGA solder joint cracking has always been a nightmare for electronic assembly (industry) manufacturer, and there are many reasons that are beyond the control of assembly manufacturer, but the final result is often required to be borne by assembly manufacturer. … Continue reading
Jun06
Questions from Newcomer: Why is Solder Paste Needed for SMT Reflow since BGA Already has Solder Balls? Is Solder Paste Needed for BGA Repair?
Questions from a newcomer about electronic manufacturing assembly process: Since there are already solder balls locate on the BGA substrate, why is it necessary to apply solder paste on the PCB pads during SMT reflow? Is it necessary to apply … Continue reading
