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Category Archives: SMT
Oct08
What Can an SPI (Solder Paste Inspection) Machine Really Do?
SPI stands for Solder Paste Inspection. If we’re talking about the actual inspection equipment, people usually add “machine” after SPI. But in most cases, when you mention SPI in an SMT factory, everyone just assumes you’re talking about the inspection … Continue reading
Sep30
How PCB S/M and Silkscreen Thickness Can Mess with Solder Paste Volume and Even Cause BGA Shorts!
Over the past few days, Workingbear came across an issue I hadn’t really considered before. Here’s the story: an EMS (electronics manufacturing service) factory reported that during SMT production, they were seeing solder shorts under BGA components. After digging into … Continue reading
May22
What is CAF (Conductive Anodic Filament) in PCBs? and How to Prevent It
One of our company’s products once experienced an issue called an “internal micro-short” in the printed circuit board (PCB). After investigation, we discovered the root cause was something called CAF (Conductive Anodic Filament). But let’s be honest—if you translate that … Continue reading
May08
The Deep Dive: BGA Pads: SMD vs. NSMD (Strength, Voids & Design Considerations)
Hey folks, welcome back to the blog! Today, we’re diving deep into something absolutely critical for the reliability of almost every electronic gadget out there: BGA solder joints. You know, those tiny connections that hold complex chips onto our printed … Continue reading
Apr03
PCB Warping and Bowing: Causes, Prevention, and Best Design PracticesPCB warpage
A user asked: “During the SMT process, PCBs often warp or bow after going through reflow high temperature. In severe cases, this can lead to defects like insufficient solder joints or tombstoning. How can we prevent and solve this issue?” … Continue reading
