Category Archives: Quality


Jun06
Questions from Newcomer: Why is Solder Paste Needed for SMT Reflow since BGA Already has Solder Balls? Is Solder Paste Needed for BGA Repair?

Questions from a newcomer about electronic manufacturing assembly process: Since there are already solder balls locate on the BGA substrate, why is it necessary to apply solder paste on the PCB pads during SMT reflow? Is it necessary to apply … Continue reading

May30
The Hidden Dangers of Using Overdue PCBs: Can Baking Salvage Them?

All materials actually have its shelf-life, some shorter and some longer than others. So what happens when expired materials are used? Think about what will happens when you eat expired food. What about using expired Printed Circuit Boards (PCBs)?

May18
Clarifying the Concept of Electronic Component Soldering Strength

While organizing an article on the structural analysis of Micro-USB connectors, Workingbear came across an interesting soldering concept that he would like to discuss with everyone. During the product development and NPI verification phase, RD often comes to me, I … Continue reading

May10
How to Bake PCB? Baking Conditions and Methods, Why Expired PCBs Need to Be Baked Before SMT or Reflow Soldering?

For many engineers, they may not understand why PCBs must be baked before going through the SMT reflow oven if they have expired their storage shelf life. Or perhaps, they believe that PCBs should be baked regardless of whether or … Continue reading

Apr21
Understanding Moisture Sensitive Devices: A Guide for Manufacturers

Moisture Sensitive Devices (MSD) refer to electronic components that are sensitive to moisture. Moisture, also known as humidity, refers to the amount of water vapor in the atmosphere that the components are exposed to. The environment is typically the factory … Continue reading