Category Archives: EDX/EDS/SEM/IMC/FTIR,


Nov13
Why BGA soldering ball always crack(3)? IMC layer growth is a certain result to form the soldering joints

post on November 13, 2019

The Intermetallic Compound (IMC) layer grows in the interface between Cu-based, Ni-based and Sn-solder is the certain result of the chemical reaction that forming the soldering joint. But the IMC layer is also the weakest location of the solder bonding-force. … Continue reading →

Design, EDX/EDS/SEM/IMC/FTIR,, SMT, Soldering     WorkingBear    Views (14,965)     comment (0)
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