Seach This Blog
Tag Cloud
AOI Baking BGA Burn/In(B/I) Carrier Component drop/detachment Concept DFx EDX/EDS/SEM ENIG FATP Flux FVT Gold HASL HIP(Head-In-Pillow) HotBar ICT IMC LTS Manufacturing glossary metal dome MFI newbie NWO(Non-Wet-Open) OSP Oxidation Panel & De-panel PIH Popcorn-Effect Problem analysis & solving PTF Red Dye Penetration Reliability Short circuit Solder broken crack Soldering Solder paste Stencil Temperature Profile Troubleshooting V-cut Warpage Wave-soldering X-raySponsor
Categories
- Connector
- Corrugated Paper
- Design
- EDX/EDS/SEM/IMC/FTIR,
- Fundamental Science
- Glue/adhesive/epoxy/underfill,
- Keypad
- Management
- Manufacture
- Moisture Sensitive
- PCB/FPC/PTF
- Personal Opinion
- Plastic
- Process
- Product Introduction
- Quality
- Reliability
- Role & Responsibility
- SMT
- Soldering
- Test/Inspection
- Uncategorized
Bookmarks
Histats
Statcounter
Email Subscription
Category Archives: EDX/EDS/SEM/IMC/FTIR,
May02
Concept Clarification: IMC Layer Fracture Despite the Formation of Effective Solder Joints
In this blog, Workingbear has explored the causes and analysis of soldering cracks and electronic component detachment in several articles. It has consistently mentioned that most of the fractures occurring when electronic components detach happen at the Intermetallic Compound (IMC) … Continue reading
Nov13
Why BGA soldering ball always crack(3)? IMC layer growth is a certain result to form the soldering joints
The Intermetallic Compound (IMC) layer grows in the interface between Cu-based, Ni-based and Sn-solder is the certain result of the chemical reaction that forming the soldering joint. But the IMC layer is also the weakest location of the solder bonding-force. … Continue reading
