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Category Archives: EDX/EDS/SEM/IMC/FTIR,
Apr23
Understanding the EDX Report: Why Does the Same Element Have Multiple Peaks?
In failure analysis reports for PCB assembly defects, we often use EDX or call EDS (Energy-Dispersive X-ray spectroscopy) for chemical elemental analysis. However, many people don’t fully understand how EDX works, and they have only a vague idea of how to … Continue reading
Apr17
How to Identify Unknown Contaminants: Choosing Between EDX/EDS and FTIR
When we discover unknown contaminants on printed circuit boards assembly (PCBA) or electronic products, how do we determine what they are and where they come from? Do we rely on experience, or do we use scientific instruments for analysis? What … Continue reading
Jan24
Top ENIG PCB Issues: Black Pad and Phosphorus-Rich Layers Explained with Prevention Tips
With the rapid adoption of smartphones, the trend toward miniaturized electronic products, and the EU’s requirements for lead-free manufacturing, Electroless Nickel Immersion Gold (ENIG) surface treatment PCB has become a popular choice for many electronic products. This is largely due … Continue reading
Sep19
Does the Gold Thickness in ENIG PCBs Affect Component Detachment?
Does the Gold Thickness in ENIG PCBs Affect Component Detachment? Do you know how the thickness of the gold layer in ENIG surface-finished PCBs impacts soldering quality? What role does the gold layer play in PCBA soldering? How could the … Continue reading
May02
Concept Clarification: IMC Layer Fracture Despite the Formation of Effective Solder Joints
In this blog, Workingbear has explored the causes and analysis of soldering cracks and electronic component detachment in several articles. It has consistently mentioned that most of the fractures occurring when electronic components detach happen at the Intermetallic Compound (IMC) … Continue reading
