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Author Archives: WorkingBear
Sep26
The Role of Immersion Gold and Electroplated Gold in PCB Soldering
Workingbear previously wrote an article about how insufficient gold thickness in the ENIG surface treatment of a PCB led to the oxidation of Electroless Nickel, weakening solder joints and causing components detachment during plug and unplug. However, many sources explain … Continue reading
Sep19
Does the Gold Thickness in ENIG PCBs Affect Component Detachment?
Does the Gold Thickness in ENIG PCBs Affect Component Detachment? Do you know how the thickness of the gold layer in ENIG surface-finished PCBs impacts soldering quality? What role does the gold layer play in PCBA soldering? How could the … Continue reading
Sep12
What Are Hard Gold, Soft Gold, Plated Gold, ENIG, and Flash Gold in PCBs?
In the electronics industry, “gold” is often used on the surface of products. But do you know what hard gold, soft gold, electroplated gold, ENIG (Electroless Nickel Immersion Gold), and flash gold are in printed circuit boards? What are the … Continue reading
Sep05
Using 2D X-Ray to Diagnose BGA Solder Void Issues
This is an X-ray inspection image of an MCU’s BGA soldering that failed after reflow. The owner mentioned that the BGA package was not functioning, but when pressing on the MCU, it would temporarily work again. Since Workingbear didn’t have … Continue reading
Aug29
How to Use 2D X-Ray to Identify BGA Issues like Non-Wetting, Cold Solder, and HIP or NWO
If you’re an SMT engineer, you’ve probably used an X-Ray inspection machine to check the soldering quality of BGAs. But, after looking at the BGA solder balls repeatedly, they all seem to look the same. So, how can you tell … Continue reading
