Seach This Blog
Tag Cloud
AOI Baking BGA Burn/In(B/I) CAF Carrier Component drop/detachment Concept DFx ECM (Electrochemical migration) ENIG FATP Flux FVT Gold HASL HIP(Head-In-Pillow) HotBar ICT IMC LCM LTS Manufacturing glossary metal dome MFI newbie NWO(Non-Wet-Open) OSP Panel & De-panel PIH Popcorn-Effect Problem analysis & solving Red Dye Penetration Reliability Short circuit Solder broken crack Soldering Solder paste Stencil Temperature Profile Troubleshooting V-cut Warpage Wave-soldering X-raySponsor
Categories
- Case study
- Connector
- Corrugated Paper
- Design
- EDX/EDS/SEM/IMC/FTIR,
- Fundamental Science
- Glue/adhesive/epoxy/underfill,
- Keypad
- Management
- Manufacture
- Moisture Sensitive
- PCB/FPC/PTF
- Personal Opinion
- Plastic
- Process
- Product Introduction
- Quality
- Reliability
- Role & Responsibility
- SMT
- Soldering
- Test/Inspection
- Uncategorized
Bookmarks
Histats
Statcounter
Email Subscription
Author Archives: WorkingBear
May30
Conformal Coating: How to Understand and Choose the Right Material
Conformal coating is a protective chemical coating or polymer film applied to printed circuit boards (PCBs) and critical electronic components to protect them from environmental factors such as moisture, dust, chemicals, and temperature extremes. This coating, typically 25 to 300 … Continue reading
May23
How to Resolve HIP or HoP Soldering Issues in BGA Solder Balls
BGA packages are prone to HIP, also known as HoP defects, during the reflow process, and it is an undeniable fact that the larger the size and the more balls a BGA package has, the more likely HIP is to … Continue reading
May02
Concept Clarification: IMC Layer Fracture Despite the Formation of Effective Solder Joints
In this blog, Workingbear has explored the causes and analysis of soldering cracks and electronic component detachment in several articles. It has consistently mentioned that most of the fractures occurring when electronic components detach happen at the Intermetallic Compound (IMC) … Continue reading
Apr25
How are decisions made regarding stencil thickness, aperture, and shape? How can solder beads be prevented?
A user asked: “How is the thickness of the stencil determined? What considerations are there for the shape of the stencil apertures?” The thickness of the stencil is mainly determined by the amount of solder paste needed for component soldering. … Continue reading
Apr18
Pros and Cons of Selective Soldering Machines
Selective soldering machines are a compromise solution in modern PCB Assembly (PCBA)processes. Despite the advancements in surface mount technology (SMT), electronic components still rely on traditional Through-Hole Technology (THT) due to cost or material constraints. Even though most components on … Continue reading