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Category Archives: SMT
Feb20
PCB Popcorn Effect: Why it Happens and How to Stop It
The main reasons for PCB delamination or “popcorning” are primarily (1) moisture absorption and (2) excessive α2/Z-axis CTE (Coefficient of Thermal Expansion). Among these, moisture absorption is responsible for about 70% of delamination issues. Other factors, such as uneven thermal … Continue reading
Feb06
Causes of Solder Empty and Tombstoning in Small Chip of Resistors and Capacitors
Recently, some people have asked about issues with solder empty in small chip SMD components like resistors and capacitors. Even after thoroughly checking the reflow oven profile settings and confirming everything is correct, solder empty still frequently occur with these … Continue reading
Jan24
Top ENIG PCB Issues: Black Pad and Phosphorus-Rich Layers Explained with Prevention Tips
With the rapid adoption of smartphones, the trend toward miniaturized electronic products, and the EU’s requirements for lead-free manufacturing, Electroless Nickel Immersion Gold (ENIG) surface treatment PCB has become a popular choice for many electronic products. This is largely due … Continue reading
Jan09
Why Do Electronic Component Leads Turn Yellow, Purple, or Blue After Reflow? Causes and Solutions
Workingbear recently received questions from readers about electronic component soldering leads turning yellow or showing discoloration (purple, blue, etc.) after going through the reflow oven. Why do the leads of components discolor after reflow? Does this discoloration affect product functionality? … Continue reading
Nov07
The Benefits of Using “Mirrored Panelization” for PCBs
In the electronics assembly manufacturing industry, what we commonly refer to as a “Mirrored Panel Board” or “Flipped Panel Board” actually comes in two types. The first type is a different-side mirrored panel board, where one board’s top side and … Continue reading
