Category Archives: Fundamental Science

Aug07
What’s the Difference Between Electromigration (EM) and Electrochemical Migration (ECM)?

post on August 7, 2025

At first glance, Electromigration (EM) and Electrochemical Migration (ECM) might seem alike. In both cases, metal atoms or ions move from a high-voltage area to a low-voltage area, and both can lead to dendrite growth. But they’re actually very different … Continue reading →

Fundamental Science, Quality, Reliability     WorkingBear    Views (688)     comment (0)
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Mar20
What is Tg (Glass Transition Temperature) and Its Role in PCBs?

post on March 20, 2025

Glass Transition Temperature (Tg) is one of the most important properties of all plastic and epoxy resin materials. In fact, the Tg value is also an indicator of the quality of the fiberglass fabric used in PCB manufacturing. However, compared … Continue reading →

Fundamental Science, PCB/FPC/PTF, Plastic     WorkingBear    Views (2,399)     comment (0)

Mar13
What is CTE (Coefficient of Thermal Expansion)? What is α2-CTE? How Does CTE Affect PCB Quality?

post on March 13, 2025

CTE (Coefficient of Thermal Expansion) refers to how a material’s geometric properties change as its temperature rises or falls due to thermal expansion and contraction. In practical applications, CTE is divided into two main categories: Coefficient of Linear Thermal Expansion … Continue reading →

Fundamental Science, PCB/FPC/PTF     WorkingBear    Views (1,879)     comment (0)
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Mar19
The Purpose of Nickel (Ni) Plating on Components or Circuit Boards in the Electronics Industry

post on March 19, 2024

Firstly, let’s clarify that Workingbear is not a metallurgy expert. The content of this article is based purely on personal experience and information gathered from the internet. If there are any errors, feel free to point them out for correction. … Continue reading →

Fundamental Science, PCB/FPC/PTF, Soldering     WorkingBear    Views (3,462)     comment (0)