Category Archives: PCB

Jun19
Increase solder paste volume will improve the MLCC capacitor broken?

Recently WorkingBear got complaint from R&D and ask increase the solder paste volume on the MLCC (Multi-Layer Ceramic Capacitor)  component pads to improve the capacitor broken issue. R&D said he had verified that the capacitor’s footprint in the board design … Continue reading

Oct01
Cooper Defined vs. Solder Mask Defined pad design for BGA soldering strength

Since the electronic product design moves from desktop to portable devices, the manufacturer also make electronic component as small as possible to meet this popular trend. Besides, the PCB thickness also become thinner and the associated soldering pads on the … Continue reading

Jul01
Why thinner PCB will need carrier for reflow process?

As the career of Manufacturing Process Engineering(MPE), WorkingBear always find there is rope wall between R&D, Marketing and Manufacturer. The R&D and Marketing always like the design be thin, sleek, and modern looking. The manufacturer always like the assembly be … Continue reading