Category Archives: SMT

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Increase solder paste volume will improve the MLCC capacitor broken?

Recently WorkingBear got complaint from R&D and ask increase the solder paste volume on the MLCC (Multi-Layer Ceramic Capacitor)  component pads to improve the capacitor broken issue. R&D said he had verified that the capacitor’s footprint in the board design … Continue reading

Comparison between shielding-can directly mount and shielding-clip/frame

Recently my top manager ask to mount the shielding-can or shielding-cover directly on the board to instead of mount the shielding-clip or shielding-frame on the board first then cover the shieling-can. He said this new process is more cheap and … Continue reading

Solution to the Drop of First-Side Part during the Second Reflow Soldering

First of all, with the rapid growth of mobile phone technology, the Electronic Manufacturing Service (EMS) in mainland China sometimes meet serious labor shortage. Second, the Industry 4.0 promotes the requirement of factory automation for each EMS. Therefore, many parts … Continue reading

Process Impact of Substituting SMD Parts with Paste-In-Hole Parts

Today, one question from my boss, “Is there any difference or influence on the process and design if we like to convert the SMD parts to DIP type and go through the PIH(Paste-In-Hole) process?” Later, I realized that the question … Continue reading

Solder Preforms – Another Choice for Solder Volume Increasing Solution

Today, most of electronic parts are developed into smaller size. The small chips are downsized from 1206 to 0805, 0603, 0402, 0201, even to 01005. The size of chip is smaller; the required solder volume is less. Moreover, the required … Continue reading

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