Category Archives: Design

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Jun19
Increase solder paste volume will improve the MLCC capacitor broken?

Recently WorkingBear got complaint from R&D and ask increase the solder paste volume on the MLCC (Multi-Layer Ceramic Capacitor)  component pads to improve the capacitor broken issue. R&D said he had verified that the capacitor’s footprint in the board design … Continue reading

Jan05
Comparison between shielding-can directly mount and shielding-clip/frame

Recently my top manager ask to mount the shielding-can or shielding-cover directly on the board to instead of mount the shielding-clip or shielding-frame on the board first then cover the shieling-can. He said this new process is more cheap and … Continue reading

Apr07
Solution to the Drop of First-Side Part during the Second Reflow Soldering

First of all, with the rapid growth of mobile phone technology, the Electronic Manufacturing Service (EMS) in mainland China sometimes meet serious labor shortage. Second, the Industry 4.0 promotes the requirement of factory automation for each EMS. Therefore, many parts … Continue reading

Jul01
Why thinner PCB will need carrier for reflow process?

As the career of Manufacturing Process Engineering(MPE), WorkingBear always find there is rope wall between R&D, Marketing and Manufacturer. The R&D and Marketing always like the design be thin, sleek, and modern looking. The manufacturer always like the assembly be … Continue reading

Jun24
Case study for the mold-in insert screw boss broken

Last time WorkingBear mentioned the potential root causes to bring the screw boss crack after mold-in screw nut insert. Actually we received the complaint from the field then asked EMS and plastic supplier to double check their inventory and found … Continue reading

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