Category Archives: Design

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Jan05
Comparison between shielding-can directly mount and shielding-clip/frame

Recently my top manager ask to mount the shielding-can or shielding-cover directly on the board to instead of mount the shielding-clip or shielding-frame on the board first then cover the shieling-can. He said this new process is more cheap and … Continue reading

Apr07
Solution to the Drop of First-Side Part during the Second Reflow Soldering

First of all, with the rapid growth of mobile phone technology, the Electronic Manufacturing Service (EMS) in mainland China sometimes meet serious labor shortage. Second, the Industry 4.0 promotes the requirement of factory automation for each EMS. Therefore, many parts … Continue reading

Jul01
Why thinner PCB will need carrier for reflow process?

As the career of Manufacturing Process Engineering(MPE), WorkingBear always find there is rope wall between R&D, Marketing and Manufacturer. The R&D and Marketing always like the design be thin, sleek, and modern looking. The manufacturer always like the assembly be … Continue reading

Jun24
Case study for the mold-in insert screw boss broken

Last time WorkingBear mentioned the potential root causes to bring the screw boss crack after mold-in screw nut insert. Actually we received the complaint from the field then asked EMS and plastic supplier to double check their inventory and found … Continue reading

May27
Improve BGA solderability by partial increase solder paste volume

How to improve the BGA (Ball Grid Array) package solderability is always a big challenge for SMT (Surface Mount Technology) process. Especially for the fine pitch (ball pitch less than 0.8mm) BGA is more difficult to be soldered on the … Continue reading

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